Activation of Mg-doped P-GaN by using two-step annealing

One- and two-step rapid thermal annealing (RTA) for activating Mg-doped p-type GaN films had been performed to compare with conventional furnace annealing (CFA). The two-step annealing process consists of two annealing steps: the first step is performed at 750 °C for 1 min and the second step is performed at 600 °C for 5 min in pure O₂ or air ambient. It is found that the samples annealed in air ambient exhibit poor electrical properties as compared to those annealed in pure O₂. Compared to one-step RTA annealing and CFA annealing, the samples with two-step annealing exhibit higher hole concentration and lower resistivity. This means that the two-step annealing is a powerful method to enhance the electrical performance of Mg-doped p-type GaN films. Similar results were also evidenced by photoluminescence (PL) measurement. Possible mechanism was confirmed by secondary ion mass spectrometry analysis.     

Control of nucleation site density of GaN nanowires

The control of nucleation site size and density for Au catalyst-driven growth of GaN nanowires is reported. By using initial Au film thicknesses of 15-50 Å we have shown that annealing between 300 and 900 °C creates Au cluster size in the range 30-100 nm diameter with a cluster density from 300 to 3500 μm⁻².Conventional optical lithography to create parallel Au stripes shoes that a minimum separation of ∼15 μm is needed to avoid overlap of wires onto neighboring lines with our growth conditions that yield wires of this same length. The GaN nanowires exhibit strong band-edge photoluminescence and total resistances of 1.2 × 10⁸-5.5 × 10⁶ Ω in the temperature range from 240 to 400 K, as determined for the temperature-dependent current-voltage characteristics.     

Blocking of interfacial diffusion at Ag/Alq3 by LiF

X-ray photoelectron spectroscopy has been applied to interface studies of Ag/tris-(8-hydroxyquinoline) aluminum (Alq₃) and Ag/LiF/Alq₃. For Ag/Alq₃, diffusion of Ag atoms into the Alq₃ layer occurs immediately after the adhesion of the metal onto the organic layer and the process lasts several hours. Insertion of a monolayer-thick LiF buffer at the interface can effectively block the diffusion process. This is quite different from what is observed from Al/LiF/Alq₃, where Al penetrates into the LiF layer as deep as several nanometers. It is thus concluded that the LiF buffer may play different roles in Ag/LiF/Alq₃ and Al/LiF/Alq₃ and hence different mechanisms may dominate in the two cases for the enhanced carrier injection observed.     

Influence of the deposition temperature on the structure and performance of tris(8-hydroxyquinoline) aluminum based flexible organic light-emitting devices

Based on indium tin oxide (ITO)/N,N′diphenyl-N-N′-di(m-tdyl) benzidine (TPD)/Alq₃/Al structure, flexible OLEDs on polyethylene terephthalate (PET) substrates were fabricated by physical vapor deposition (PVD) method. Tris(8-hydroxyquinoline)aluminum (Alq₃) films were deposited at 90, 120 and 150 °C to examine the influence of the deposition temperature on the structure and performance of OLEDs. Electroluminescence (EL) spectra and current-voltage-luminance (I-V-L) characteristics of the OLEDs were examined. It was found that the device fabricated at a high temperature had a higher external efficiency and longer lifetime. Atomic force microscope (AFM) was adopted to characterize the surface morphology of ITO/TPD/Alq₃. The higher uniform morphology of the Alq₃ formed at high temperature might contribute to the performance improvement of the OLEDs.     

闪锌矿相GaN热容和格林爱森参数

利用壳层模型分子动力学方法，在高温高压条件下对闪锌矿相GaN的压力体积关系、定压和定容热容及格林爱森参数进行了比较研究，其中Ga-Ga、Ga-N和N-N三组离子对间的相互作用通过极化势模型来描述，即出于对半导体材料GaN离子特性的考虑而分别给予Ga离子和N离子以两组不同大小的电荷．结果表明计算得到的环境条件下的热力学参数和最近的其他理论结果吻合，同第一性原理计算结果比较，定容热容在低温下的差别可以用来解释不同方法所采用的不同近似机制．最后在300?2000 K和0?40 GPa条件下，对闪锌矿相GaN的物理特性做了总结．     

蓝宝石邻晶面衬底MBE生长GaN薄膜的瞬态光电导弛豫特性研究

在实验优化MBE工艺条件的基础上，采用蓝宝石(0001)邻晶面衬底制备出了具有较高质量的GaN薄膜.XRD分析表明邻晶面衬底生长的GaN薄膜晶体结构质量明显提高，AFM表征结果显示邻晶面生长的样品表面形貌显著改善.蓝宝石衬底GaN薄膜的瞬态光电导弛豫特性对比实验研究发现，常规衬底生长的GaN薄膜光电导弛豫特性出现双分子复合、单分子复合和弛豫振荡三个过程，持续时间分别为0.91，7.7和35.5ms；蓝宝石邻晶面衬底生长的GaN薄膜光电导弛豫过程主要是双分子复合和单分子复合过程，持续时间分别为0.78和14ms.理论分析表明MBE生长GaN薄膜的持续光电导效应主要起源于本生位错缺陷引发的深能级. 关键词： 邻晶面蓝宝石衬底 GaN薄膜 瞬态光电导 弛豫特性     

掺Er/Er+O的GaN薄膜光学性质的研究

利用Raman散射谱研究了GaN注Er以及Er+O共注样品的振动模，并讨论了共注入O对Er离子发光的影响. 在Raman散射谱中，对于注Er的GaN样品出现了300 cm^-1和670 cm^-1两个新的Raman峰，而对于Er+O共注样品，除了上述两个峰外，在360 cm^-1处出现了另外一个新的峰，其中300 cm^-1峰可以用disorder-activated Raman scattering (DARS)来解释，670 cm^-1峰是由于与N空位相关的缺陷引起的，而360 cm^-1峰是由O注入引起的缺陷络合物产生的. 由于360 cm^-1模的缺陷出现，从而导致Er+O共注入GaN薄膜红外光致发光(PL)强度的下降. 关键词： GaN Er Raman散射 光致发光     

基于λ/4相移分布反馈半导体激光器四波混频的THz波长转换特性研究

利用耦合模方程，分析了基于λ/4相移分布反馈半导体激光器四波混频的波长转换特性.数值模拟表明：增大偏置电流、减小失谐量有利于扩展转换效率及消光比的动态范围，同时恶化了频率啁啾的动态范围; 受激射效应影响，消光比及频率啁啾在弛豫振荡频率处达到极大值.通过合理选择系统参量，可以获得较理想的波长转换效果.该方案无需抽运光输入，可实现高速、宽带波长转换，在光通信系统中有一定的应用前景. 关键词： λ/4相移分布反馈半导体激光器')" href="#">λ/4相移分布反馈半导体激光器 四波混频 波长转换     

高击穿电压的AIGaN/GaN FP-HEMT研究与分析

就蓝宝石衬底上制备的AlGaN／GaN场（field plate）HEMT器件、常规HEMT器件性能进行了分析对比．结果证明两种结构的器件直流参数变化不大，但是采用场板后器件的击穿电压从52V提高到了142V．在此基础上利用Sivaco软件对两种器件进行模拟仿真，深入分析了FP对器件击穿电压的影响．     

高分子发光二极管载流子注入过程研究

采用交流阻抗谱，电容-电压，电容-频率等实验方法，研究了共轭高分子MEH-PPV(poly［2-methoxy，5-(2-ethylhexoxy)-1，4-phenylene vinylene］)发光二极管的载流子注入过程.对于结构为ITO/PEDOT/MEH-PPV/Ba/Al的发光器件，实验结果表明，电极界面是欧姆接触的，载流子的注入是非平衡的，器件薄膜中存在陷阱容易俘获注入电荷，形成空间电荷区，陷阱密度约为3.75×10¹⁶cm^-3. 关键词： 高分子发光二极管 交流阻抗谱 cole-cole图 载流子注入